Webinar

Beyond the Limits: Powering and Cooling Next-Generation AI Workloads

AI and high-performance computing are pushing rack densities to new levels, forcing data center operators to rethink how power and cooling infrastructure is designed and deployed.

Originally broadcast as part of Data Center Dynamics' AI Week 2026, this session brings together experts from Legrand and DCD to examine the implications of increasingly demanding AI workloads for new and existing data centers alike.

The discussion explores the limitations of current OCP architectures at extreme densities, as well as emerging approaches, including higher-voltage DC distribution and power sidecars. It also considers advances in two-phase direct-to-chip cooling and how power and cooling strategies will need to evolve together to support increasingly powerful AI hardware.

Watch the on-demand session for practical perspectives on scaling power and cooling infrastructure for the next generation of AI.

Key Topics:

• How increasing AI rack densities are changing power distribution and data center design
• The challenges of adapting existing facilities to support higher-density AI infrastructure
• How emerging power architectures, including higher-voltage DC, could support future AI power demands
• The evolving role of cooling, including two-phase direct-to-chip, as compute densities increase
• How operators can build greater scalability and flexibility as AI requirements evolve